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  1. Wafer Bonding
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    During the past decade direct wafer bonding has developed into a mature materials integration tec...

    Unser bisheriger Preis:ORGPRICE: 385,40 €

    Jetzt 385,39 €Ebook
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  2. Nanoscale Characterisation of Ferroelectric Materials
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    Among the main trends in our daily society is a drive for smaller, faster, cheaper, smarter compu...

    Unser bisheriger Preis:ORGPRICE: 166,66 €

    Jetzt 166,65 €Ebook
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  3. Buch
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    Among the main trends in our daily society is a drive for smaller, faster, cheaper, smarter compu...

    160,49 €Buch
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  4. Wafer Bonding
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    Taschenbuch
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    During the past decade direct wafer bonding has developed into a mature materials integration tec...

    Unser bisheriger Preis:ORGPRICE: 374,49 €

    Jetzt 277,13 €Taschenbuch
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  5. Nanoscale Characterisation of Ferroelectric Materials
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    Taschenbuch
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    Among the main trends in our daily society is a drive for smaller, faster, cheaper, smarter compu...

    Unser bisheriger Preis:ORGPRICE: 181,85 €

    Jetzt 160,49 €Taschenbuch
    Alle Preise inkl. MwSt | Versandkostenfrei
  6. Buch
    Print on Demand

    During the past decade direct wafer bonding has developed into a mature materials integration tec...

    374,49 €Buch
    Alle Preise inkl. MwSt | Versandkostenfrei
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