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  1. Force Sensors for Microelectronic Packaging Applications
    0 %
    Ebook
    Sofort lieferbar

    Intended for wire-bonding and flip-chip packaging professionals and for scientists and enginee...

    Unser bisheriger Preis:ORGPRICE: 113,25 €

    Jetzt 96,28 €Ebook
    Alle Preise inkl. MwSt
  2. Taschenbuch
    Print on Demand

    Intended for wire-bonding and flip-chip packaging professionals and for scientists and enginee...

    106,99 €Taschenbuch
    Alle Preise inkl. MwSt | Versandkostenfrei
  3. Force Sensors for Microelectronic Packaging Applications
    0 %
    Buch
    Besorgungstitel - wird vorgemerkt

    Intended for wire-bonding and flip-chip packaging professionals and for scientists and enginee...

    Unser bisheriger Preis:ORGPRICE: 106,99 €

    Jetzt 106,98 €Buch
    Alle Preise inkl. MwSt | Versandkostenfrei
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